Trade Show Support & Interpreter in Tokyo

Trade Show:
27th ELECTROTEST JAPAN

Venue:
Tokyo Big Sight in Tokyo, Japan

Dates:
January 20 to 22, 2009

Exhibits:
X-ray Inspection Equipment, Infrared Test Equipment, Board Vision Inspection Equipment, Solder Vision Inspection Equipment, Ball Machine Vision Inspection Equipment, TAB Vision Inspection Equipment, Bump Vision Inspection Equipment, Lead Frame Vision Inspection Equipment, PCB Vision Inspection Equipment, Electronic Components Vision Inspection Equipment, In-Circuit Testers, Functional Solder Testers, Bare Board Testers, IC / LSI Testers, Testing Sockets for BGA/CSP, Burn-in Inspection Equipment, Inspection Jig / Test Fixtures / Probes / Testing Stages, Thermostatic and Humid Static Testing Units, Environmental Test Equipment, 2-D / 3-D Inspection Systems, Film Thickness Measurement Equipment, Optical Microscopes, Endurance Testing Equipment / Vibration Gauge, Viscometers

URL:
http://www.electrotest.jp/et/en/

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